CHO-BOND 1038 ONE COMPONENT ELECTRICALLY CONDUCTIVE SILICONE SEALANT | 日本
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CHO-BOND 1038 ONE COMPONENT ELECTRICALLY CONDUCTIVE SILICONE SEALANT

CHO-BOND 1038 is a silver-plated copper
filled, one-component conductive silicone.
It is designed for use as a fillet, gap filler
and seam sealant on electrical enclosures
for EMI shielding or electrical grounding.

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Description
    CHO-BOND 1038 is a silver-plated copper
    filled, one-component conductive silicone.
    It is designed for use as a fillet, gap filler
    and seam sealant on electrical enclosures
    for EMI shielding or electrical grounding.
    Minimum recommended bond line for CHOBOND
    1038 is 0.007 inches (0.18mm). In
    addition, CHO-BOND 1038 may be used for
    EMI gasket repair, bonding, and attachment
    in applications where moderate strength
    (less than 150 psi) is required. CHO-BOND
    1038’s moisture cure silicone polymer
    system allows it to cure to the touch in 24
    hours and provides a robust conductive and
    environmental seal over a wide range of
    application temperatures. For applications
    requiring zero volatile organic compounds
    (VOCs) or minimal shrinkage, Parker
    Chomerics offers a solvent free version of
    CHO-BOND 1038 called CHO-BOND 1121.
    For best adhesion results, CHO-BOND 1038
    should be used in conjunction with CHOSHIELD
    1086 primer. Typical applications
    include man portable electronics, radar and
    communication systems, EMI vents, military
    ground vehicles, and shelters.

    Features and Benefits:

    • One component
    • Easy to use, no weighing or mixing required.
    • Silver plated copper filler
    • Excellent conductivity 0.010 ohm-cm
    • Moisture cure silicone • 30 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure.
    • Non corrosive cure mechanism
    • No corrosive by-products generated during curing to damage substrate.
    • Medium paste
    • Easy to dispense, apply and spread, can be used on overhead or vertical surfaces.
    • No VOCs version: CHO-BOND 1121
    • Minimal shrinkage, no permits or ventilation required.
Description

機能特性

ポリマー製品ファミリー

Silicone

フィルター材

Silver-plated copper

比率

1-part

Gray

体積抵抗 (ohm-cm)

0.01

せん断強度 (kPa)

1034

比重

3.6

公称硬度 (ショア A)

80

温度の範囲 (C)

-55 to 125

作動時間

0.5 hour

貯蔵寿命 (月)

6

フィルム厚さ (mm)

0.18-3.18

お問合せ

パーカー・ハネフィン日本株式会社
東京都港区白金台3-2-10
白金台ビル2F
〒108-0071
電話 03-6408-3901(営業本部)
FAX  03-5449-7202