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CHO-BOND 1029 is a silver plated copper filled, two-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved.

CHO-BOND 1030 is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved.

CHO-BOND 360-20 is a two-component, silver plated copper filled conductive epoxy adhesive.

CHO-BOND 584-208 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.

CHO-BOND 584-29 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved.

TECKNIT 8116 is a two-component, silver filled conductive epoxy adhesive designed for applications where a strong, highly conductive electrical bond must be achieved.

CHO-BOND 580-208 is a two-component, silver filled conductive epoxy adhesive system designed to be thinned and applied as an ink or spray coating.

CHO-BOND 592 is a highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics.

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