導電性シーリング材  製品 パーカーより

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導電性シーリング材 ( 1 - 11 / 11 )
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TECKNIT 0002 is a silver filled, onecomponent conductive silicone, designed
for use as a fillet, gap filler and seam
sealant on electrical enclosures for EMI
shielding or electrical grounding.

CHO-BOND 1075 is a silver plated aluminum
filled, one-component conductive silicone
designed for use as a fillet, gap filler and
seam sealant on electrical enclosures.

CHO-BOND 1038 is a silver-plated copper
filled, one-component conductive silicone.
It is designed for use as a fillet, gap filler
and seam sealant on electrical enclosures
for EMI shielding or electrical grounding.

CHO-BOND 4660 is a silver-plated copper filled, one-component conductive polyisobutylene. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.

CHO-BOND® 2165 is a stabilized-copper
filled, two-component polyurethane
conductive sealant specifically designed
for aerospace and military applications.

CHO-BOND® 1035 is a silver-plated glass filled, onecomponent conductive silicone designed for use as a fillet, gap filler and seam sealant for electrical enclosures.


CHO-BOND 4660 is a silver-plated copper filled, one-component conductive polyisobutylene. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.

CHO-BOND 1016 is a nickel-plated graphite
filled, one-component conductive silicone
specifically designed for use as a fillet, gap
filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.

CHO-BOND 1121 is a silver-plated copper
filled, one-component conductive silicone.
It is designed for use as a fillet, gap filler
and seam sealant on electrical enclosures
for EMI shielding or electrical grounding.

TECKNIT 0005 is a silver-plated glass filled, one-component conductive polyolefin, designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.

CHO-BOND 1019 is a silver plated aluminum filled, two-component conductive polythioether designed for use as a fillet, gap filler and seam sealant on military shelters and electrical enclosures for EMI shielding.

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パーカー・ハネフィン日本株式会社
東京都港区白金台3-2-10
白金台ビル2F
〒108-0071
電話 03-6408-3901(営業本部)
FAX  03-5449-7202