EMI Shielding 製品 パーカーより

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EMI Shielding ( 1 - 20 / 148 )
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Product Listing

SOFT-SHIELD 5000 Series gaskets offer a low cost and high performance EMI gasketing solution for commercial electronic systems.

Parker Chomerics CHOFORM 5528 Ag filled silicone is ideal for today’s densely populated electronics packaging. Full moisture cure in 24 hrs at 22 C with soft low closure force properties.

TECKNIT 0002 is a silver filled, onecomponent conductive silicone, designed
for use as a fillet, gap filler and seam
sealant on electrical enclosures for EMI
shielding or electrical grounding.

CHO-SHIELD 604 is a highly conductive, advanced coating developed for high volume, precise spray applications on circuit boards and semiconductor packages.

SOFT-SHIELD 3700 allows the use of fabric over foam EMI/Grounding gasketing technology to be used in elevated temperature applications where continuous operating temperatures of 125C or less are required.

Parker Chomerics CHO-SHIELD 2001 Series electrically conductive coatings provide a corrosion resistant conductive surface coating on aluminum or composite substrates.

CHO-BOND 1075 is a silver plated aluminum
filled, one-component conductive silicone
designed for use as a fillet, gap filler and
seam sealant on electrical enclosures.

CHO-SHIELD 596 is a two component, silver filled, conductive epoxy paint formulated to provide EMI shielding and electrical grounding on plastic and composite substrates.

CHO-BOND 1038 is a silver-plated copper
filled, one-component conductive silicone.
It is designed for use as a fillet, gap filler
and seam sealant on electrical enclosures
for EMI shielding or electrical grounding.

CHO-SHIELD® 2056 is an electrically conductive, one-component silver and silver/copper-filled acrylic coating that is specially formulated for application on plastics to provide high levels of EMI shielding.

Parker Chomerics CHO-SHIELD 2003 Series electrically conductive coatings provide a corrosion resistant conductive surface coating on aluminum or composite substrates.

The CHO-MASK II family of EMI foil tapes includes both Standard Tack (ST) and High Tack (HT) versions for providing a conductive, non-corroding surface on painted metal electronic enclosures.

SOFT-SHIELD 2000 gaskets consist of silver-plated nylon yarn knitted over a highly compressible, thermoplastic EPDM foam core.

CHO-BOND 1029 is a silver plated copper filled, two-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved.

The SOFT-SHIELD 3500 fabric over foam (FOF) product family is a group of low-closure force EMI/EMC gaskets. SS3500 offers a low cost/low closure force competitive solution for EMI shielding and electrical grounding in shear and compression.

CHO-BOND 1030 is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved.

CHO-BOND 360-20 is a two-component, silver plated copper filled conductive epoxy adhesive.

COMBO STRIP gaskets are a resilient, highly conductive sealing solution consisting of knitted wire mesh integrated with an elastomer weather seal.

Parker Chomerics offers a selection of EMI gasket materials that provide effective EMI shielding and pressure sealing for choke, cover and contact flanges.

POLA SOLID is a composite electromagnetic interface (EMI) shielding and environmental sealing gasket material consisting of hundreds of individual fine wires embedded into the z-axis of solid elastomer.

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パーカー・ハネフィン日本株式会社
東京都港区白金台3-2-10
白金台ビル2F
〒108-0071
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