T-WING Heat SpreadersThin Heat Spreaders | 日本

T-WING Heat SpreadersThin Heat Spreaders

Chomerics’ family of thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are inappropriate.

    Chomerics’ family of thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are inappropriate.
    T-Wing spreaders consist of 5oz. (0.007inch/0.18mm thick) flexible copper foil between electrically insulating films. High strength silicone PSA (pressure-sensitive adhesive) provides a strong bond to the component. The compliant
    nature of these “thermal wing” heat
    spreaders permits nearly 100% adhesive contact with non-flat package surfaces, optimizing thermal and mechanical performance.
    • Component junction temperature reduction of 10-20°C is common
    • Easily added to existing designs to lower component temperatures and improve reliability
    • Custom shapes available for complex designs
    Typical Applications
    • Microprocessors
    • Memory modules
    • Laptop PCs and other high density, handheld portable electronics
    • High speed disk drives
    Design Details
    • Low profile (0.33mm/0.013in) allows use in limited space environments
    • Easy peel and stick adhesion to all surfaces, including packages with residual silicone mold release
    • Offers low cost cooling for many package types
    • Low application force
    (<5psi/ 0.03MPa) minimizes risk of damage to component
    • Available in a range of standard sizes
    • Pliable nature allows conformance to concave or otherwise non-flat surfaces for optimal thermal and mechanical performance
    • Light weight (0.039 oz/inch2)
    • Standard parts are scored for easy forming and alignment
    • Easy removal for device replacement
    • Available die-cut on continuous rolls

    T-Wing® Heat Spreaders
    Testing Summary
    Summaries of test procedures used for T-Wing heat spreaders are described below. Thermal performance, adhesion strength and visual inspection were used as pass/fail criteria.

    Anatek® Thermal Analyzer: The ATA was used to measure Rj-a before and after environmental stressing. PQFP: 196 lead, plastic PQFPs known to contain silicone mold release were evaluated. T-Wing Heat Spreader: 1 inch x 4 inch TWing parts were applied to the PQFP packages with a 5 psi (0.03 MPa) mounting pressure.

    Thermal Performance
    Various sizes of T-Wing heat spreaders were applied to a 196 lead PQFP
    using less than 5 psi (0.03 MPa) bonding pressure. Within 30 minutes of application, the test boards were mounted in an Analysis Tech® thermal analyzer. The devices were heated to equilibrium (45 to 60 minutes) with
    approximately 3 watt load on 3 x 3 inch
    (7.6 x 7.6 cm) test boards. Two test environments were used: restricted convention, achieved with a 1 x 5 x 6
    inch (2.5 x 12.7 x 15.2 cm) plexiglass
    box; and 100 LFM (30m/min) air flow. Results were obtained using thermocouples for Tc (centered on case) and Rj-a.

    Environmental Stressing
    Control: Specimens were maintained for 1000 hours at standard laboratory conditions, 23°C, 35-60% RH.

    Heat Aging: Test specimens were placed in a forced convection hot air oven maintained at 150°C ±5°C for 1000 hours. Test specimens were then removed and tested.

    ElevatedTemperature/HighHumidity: Specimens were placed in a humidity chamber maintained at 85°C ±2°C and 90%-0 +10% RH for 1000 hours.

    Temperature Cycling: Specimens were subjected to 500 cycles from -50°C
    to +150°C in a Tenney Temperature Cycling Oven.

    Temperature Shock: Specimens were subjected to 100 temperature shocks by immersion into -50° and +150°C liquids. Temperatures were monitored with thermocouples.

    Evaluation Procedure

    Visual: All test specimens were exam- ined for de-bonding, delamination or other signs that the tape was failing after environmental stress.

    Thermal Performance: T-Wing was applied to the PQFP with 5 psi mount- ing pressure. After a one hour dwell, the Rj-a of each specimen was mea- sured at 100 LFM and under restricted convection conditions. The Rj-a was again measured after environmental stressing.

    90° Peel Strength: A T-Wing heat spreader was applied to each PQFP with 5 psi mounting pressure. The specimens were subjected to environ- mental stress and then tested for 90° peel strength at room temperature.




0.013 (0.33)


Silicone based PSA

フィルム厚さ (mm)



Black polyester

絶縁体の厚さ (inch)



0.039 oz/inch^2



最高作動温度 (C)


材料の厚さ (inch)


絶縁耐力 (VAC/mil)


体積抵抗 (ohm-cm)


1000 kHz 時の正接


貯蔵寿命 (月)



UL 94 V-0, RoHS


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