THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials | 日本
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THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials

THERM-A-FORM™ T642 is a high thermal performance material with flexibility and low outgassing ideal for underfilling.

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Description

    Description
    THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable formin-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.


    THERM-A-FORM™ T64x and 164x Series
    Features / Benefits

    • Dispensable form-in-place gap filling, potting, sealing, and encapsulating
    • Excellent blend of high thermal conductivity, flexibility, and ease of use
    • Conformable to irregular shapes without excessive force on components
    • Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
    • Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
    • Vibration damping


    Product Attributes
    T642
    • High thermal performance with flexibility
    • Ideal for underfilling
    • Low outgassing
Description

機能特性

熱伝導率 (W/m-K)

1.2

パッケージ

10:1 Dual element Cartridge

Blue

ポリマー製品ファミリー

Silicone

フィルター材

Boron Nitride

比率

10:01

比重

1.5

公称硬度 (ショア A)

70

粘度 (Poise)

2500

熱容量 (J/g-K)

1

熱膨張の係数 (ppm/K)

300

温度の範囲 (F)

-58 to 302

絶縁耐力 (VAC/mil)

500

体積抵抗 (ohm-cm)

1.0 x 1013

1000 kHz 時の誘導率

4

1000 kHz 時の正接

0.001

証明書に対応

UL 94 V-0, RoHS

ガス放出、% TML (% CVCM)

0.32 (0.21)

貯蔵寿命 (月)

3

お問合せ

パーカー・ハネフィン日本株式会社
東京都港区白金台3-2-10
白金台ビル2F
〒108-0071
電話 03-6408-3901(営業本部)
FAX  03-5449-7202