熱伝導材料  製品 パーカーより

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熱伝導率の範囲 (W/m-K)

熱伝導率の範囲 (W/m-K)

貯蔵寿命 (月)

貯蔵寿命 (月)

熱伝導率 (W/m-K)

熱伝導率 (W/m-K)

公称硬度 (ショア 00)

公称硬度 (ショア 00)

公称硬度 (ショア A)

公称硬度 (ショア A)

キャリアの種類

キャリアの種類

証明書に対応

証明書に対応

比重

比重

熱膨張の係数 (ppm/K)

熱膨張の係数 (ppm/K)

熱容量 (J/g-K)

熱容量 (J/g-K)

ガス放出、% TML (% CVCM)

ガス放出、% TML (% CVCM)

熱インピーダンス (°C-cm2/W)

熱インピーダンス (°C-cm2/W)

体積抵抗 (ohm-cm)

体積抵抗 (ohm-cm)

絶縁耐力 (VAC/mil)

絶縁耐力 (VAC/mil)

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熱伝導材料 ( 1 - 20 / 48 )
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THERM-A-FORM™ T644 is a high thermal performance very low modulus material for transferring heat from fragile electronic components

THERM-A-FORM™ T642 is a high thermal performance material with flexibility and low outgassing ideal for underfilling.

CHO-THERM 1671 HIGH-POWER THERMAL INSULATOR PADS are thermally conductive materials designed for use where high reliabilty in Aerospace and Defense applications.

THERM-A-FORM™ 1641 is a thermally conductive silicone elastomer product that is a one-component moisture cure RTV, supplied with primer 1086 (primer is not required for cure but promotes adhesion) and non-acetic acid generating compound.

THERMFLOW® T725 phase-change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids with superior thermal performance and is ideal for vertical applications.

THERMATTACH T404 double-sided thermal interface tapes provide exceptional bonding properties between electronic components and heat sinks and excellent dielectric strength due to polyimide carrier and is UL94 V-0 rated.

CHO-THERM Commercial Grade Thermal Insulator Pads are designed for use where solid thermal and electrical properties are required at an economical price.

THERM-A-GAP™ T630 Gel is a highly conformable, pre-cured, single- component compound with 0.7 W/m-K Thermal Conductivity.

THERM-A-GAP™ T636 Gel is a highly conformable, pre-cured, single- component compound with 2.4 W/m-K Thermal Conductivity.

Chomerics’ family of thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are inappropriate.

THERM-A-GAP™ 580 gap-filler sheets and pads offer excellent thermal properties and highest conformability at low clamping forces.

THERM-A-FORM™ 1642 is a general duty, economical, two-component thermally conductive encapsulant/sealant/ caulk/potting compound.

THERM-A-GAP™ 569 gap-filler sheets and pads are an economical combination of thermal performance and conformability.

THERMFLOW® T558 phase-change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids with superior thermal performance and a conformal foil allows for clean break/rework and eliminates top liner.

CHO-THERM Commercial Grade Thermal Insulator Pads are designed for use where solid thermal and electrical properties are required at an economical price.

THERM-A-GAP™ 570 gap-filler sheets and pads offer excellent thermal properties and highest conformability at low clamping forces.

THERM-A-GAP 579 gap-filler sheets and pads offer excellent thermal properties and highest conformability at low clamping forces.

THERMFLOW® T777 phase-change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids.
They also displace entrapped air between power dissipating electronic components.

CHO-THERM HIGH-POWER THERMAL INSULATOR PADS are thermally conductive materials designed for use where the highest possible thermal, dielectric, and mechanical properties are required.

THERM-A-GAP™ T635 Gel is a highly conformable, pre-cured, single- component compound with 1.7 W/m-K Thermal Conductivity.

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パーカー・ハネフィン日本株式会社
東京都港区白金台3-2-10
白金台ビル2F
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