EMI Shielding Gaskets Products from parker include

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EMI Shielding Gaskets ( 1 - 20 of 83 )
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SOFT-SHIELD 5000 Series gaskets offer a low cost and high performance EMI gasketing solution for commercial electronic systems.

Parker Chomerics CHOFORM 5528 Ag filled silicone is ideal for today’s densely populated electronics packaging. Full moisture cure in 24 hrs at 22 C with soft low closure force properties.

SOFT-SHIELD 3700 allows the use of fabric over foam EMI/Grounding gasketing technology to be used in elevated temperature applications where continuous operating temperatures of 125C or less are required.

SOFT-SHIELD 2000 gaskets consist of silver-plated nylon yarn knitted over a highly compressible, thermoplastic EPDM foam core.

The SOFT-SHIELD 3500 fabric over foam (FOF) product family is a group of low-closure force EMI/EMC gaskets. SS3500 offers a low cost/low closure force competitive solution for EMI shielding and electrical grounding in shear and compression.

Parker Chomerics offers a selection of EMI gasket materials that provide effective EMI shielding and pressure sealing for choke, cover and contact flanges.

POLA SOLID is a composite electromagnetic interface (EMI) shielding and environmental sealing gasket material consisting of hundreds of individual fine wires embedded into the z-axis of solid elastomer.

Parker Chomerics CHOFORM 5513 Ag/Cu filled silicone is ideal for today’s densely populated electronics packaging. Full thermal cure in 30 mins at 140 C with excellent electrical and adhesion properties.

Parker Chomerics military and commercial-grade elastomer material is available in sheet form. We are able to meet most design requirements with standard sizes and thicknesses.

SOFT-SHIELD 4800 Multi-planar conductive Z axis foam EMI gaskets represent Parker Chomerics newest innovation in soft foam based EMI shielding technology.

Parker Chomerics CHOFORM 5560 Ni/C filled silicone is ideal for today’s densely populated electronics packaging. Full Thermal cure in 30 mins at 150 C with excellent corrosion resistant properties on aluminium.

SOFT-SHIELD 4850-STRIP multi-planar, Z-axis conductive strip gaskets are a new, and convenient form of the successful 4850 EMI sheet gasket.

POLA SPONGE is a composite electromagnetic interface (EMI) shielding and environmental sealing gasket material consisting of hundreds of individual fine wires embedded into the z-axis of soft closed cell, silicone sponge elastomer.

High durability, exceptionally soft easy-to-install SOFT-SHIELD 1000 gaskets are specially designed for EMI shielding commercial electronic enclosures with low closure force requirements, where weather sealing is not a requirement.

Parker Chomerics CHOFORM 5550 Ni/C filled silicone is ideal for today’s densely populated electronics packaging. Full Thermal cure in 30 mins at 150 C with corrosion resistant properties and softer then CHOFORM 5541.

Parker Chomerics CHOFORM 5538 Ni/C filled silicone is ideal for today’s densely populated electronics packaging. Full moisture cure in 4 hrs at 22 C with corrosion resistance and small bead properties.

Parker Chomerics SPRING-LINE D-connector gaskets answer most shielding and grounding needs for standard connector interfaces. The gaskets are available in both high performance beryllium-copper and economical stainless steel.

Parker Chomerics CHOFORM 5526 Ag filled silicone is ideal for today’s densely populated electronics packaging. Full moisture cure in 24 hrs at 22 C with excellent electrical and shielding properties.

Parker Chomerics CHOFORM 5541 Ni/C filled silicone is ideal for today’s densely populated electronics packaging. Full Thermal cure in 30 mins at 150 C with corrosion resistant high temp properties.

ParPHorm 1800 is a non-conductive, moisture cure, form-in-place (FIP), silicone elastomer sealing material.

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Contact Us

Americas
USA, Canada, Mexico
c-parker@parker.com
1-800-272-7537
Europe
00800 27 27 5374
AOG (Aircraft on Ground)
1-949-851-4357