CHO-BOND 4660 Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant | Product Series

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CHO-BOND 4660 Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant

CHO-BOND 4660 Silver-Plated Copper Filled Polyisobutylene Electrically Conductive Sealant

Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required

Teknik Özellikler

  • Polimer Malzeme Seçenekleri: Polyisobutylene
  • Dolgu Malzemesi: Silver-plated copper
  • Paket Türü: 2 Fluid Ounce Aluminum Foil Tube, 0.1 Gallon Fiber Cartridge
  • Primer Dâhil: Not Required
  • Renk: Black
  • Hacim Direnci: 0.080 Ω-cm
  • Özgül Ağırlık: 2.06
  • Sertlik Ölçer: n/a
  • Çalışma Sıcaklığı: -55 to 100 °C
  • Çalışma Süresi: 0.5 Hours
  • İvmelenme Torku: 6 Months
  • Film Kalınlığı: 0.18 to 3.18 mm
Safety Warning

Tam Ürün Açıklaması

Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required. CHO BOND® 4660 is a black-colored material that possesses identical properties of CHO BOND® 4669 except for a shortened working life.

Features and Benefits:
• One-component system so no mixing or measuring required
• Good conductivity levels (0.080 ohm-com)
• No corrosive by-products generated during drying
• No primer required
• Excellent impermeability to gases
• Minimal weight added to assembly due to lightweight material
• Easily dispensed using a standard caulking gun

Typical Applications:
• Access panels
• Shielded room joints
• Temporary military shelters
• Hardware
• Bulkhead feed-through fittings
• Building conduits

İlişkili Belgeler

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Ürün Ağırlık (g)
51-02-4660-0000 113.4
51-05-4660-0000 681

688368
179336