Parker Chomerics CHO-FORM® family of conductive form-in-place gasket materials are ideal for densely populated electronics packaging, especially where intercompartmental isolation is required. The form-in-place characteristics mean that CHO-FORM® can be used in rapid prototyping applications on substrates such as castings, machined metal, conductive plastic housings, and at board level.

Parker Chomerics CHO-FORM® 5550 form-in-place EMI gasket is a one-component, low hardness, thermal cure silicone system with greater than 65 dB shielding effectiveness and good galvanic corrosion resistance on mated aluminum surfaces. CHO-FORM® 5550 consists of a low cost Ni/Graphite particle filler and utilizes a thermal cure technology which allows for a minimal cure cycle of only 30 minutes at 150°C. While it requires a larger bead size than CHO-FORM® 5541, it has a lower relative hardness (Shore A 55)

Features and Benefits:
• Up to 60% reduced installation cost and nominal cost for production scale-up
• Up to 60% space savings within enclosures (gasketing available for flanges as narrow as 0.025 in)
• Excellent adhesion to common housing substrates (4-12 N/cm adhesion)
• Highly compressible gaskets, ideal for low closure force housings
• Quick turn-around of prototypes and samples

Parker Chomerics Capabilities:
• Fully programmable 3 axis application technology
• Tight dimensional control and bead termination (0.001-inch tolerance of bead size)
• Automated dimensional verification of gasket bead placement using optical measuring technology

Typical Applications:
• Densely populated electronics packaging
• PCB inter-compartmental isolation with thin wall boundaries
• Castings, machined metal, and conductive plastic enclosures
• Transportation/Automotive sensor housing
• Military and Aerospace electronics
• Telecom
• Life Science

CHO-FORM 5550 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing