Catálogo: Materiales para encapsulado

Product Catalog - Potting & Encapsulation Materials Catalog

Product Catalog - Potting & Encapsulation Materials Catalog (Chinese) - China only

Product Catalog - Potting & Encapsulation Materials Catalog (English A4) - India only

CoolTherm® EP-6007 BLK/Thermoset® No. 67 Epoxy System

CoolTherm® EP-6007 BLK/Thermoset® No.67 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.

cooltherm-ep-6007-blk-thermoset-no-67-epoxy-system

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