Product Catalog - Potting & Encapsulation Materials Catalog

Product Catalog - Potting & Encapsulation Materials Catalog (Chinese) - China only

Product Catalog - Potting & Encapsulation Materials Catalog (English A4) - India only

Product Catalog - Potting & Encapsulation Materials Catalog (Mexican Spanish)

CoolTherm® EP-6007 BLK/6010 Epoxy System

CoolTherm® EP-6007 BLK/6010 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.

cooltherm-ep-6007-blk-6010-epoxy-system

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