CHO-BOND 1075 Silver-Plated Aluminum Filled Silicone Electrically Conductive Sealant for Corrosion Resistance | Product Series

Sorter efter

    Ingen filtre valgt

Vægt (g)

Primer medfølger

Erhalten Sie Ihr Parker Konto noch heute!

Erstellen Sie ein Konto, um alles zu verwalten, was Sie mit Parker tun – von Ihren Voreinstellungen für Bestellungen bis zum Zugriff auf Anwendungen.


LOADING IMAGES
CHO-BOND 1075 Silver-Plated Aluminum Filled Silicone Electrically Conductive Sealant for Corrosion Resistance

CHO-BOND 1075 Silver-Plated Aluminum Filled Silicone Electrically Conductive Sealant for Corrosion Resistance

Parker Chomerics CHO BOND® 1075 is a one component, silver-plated aluminum filled sealant formulated to resist galvanic corrosion on aluminum substrates while providing excellent shielding and conductivity

Tekniske specifikationer

  • Polymermaterialevalg: Silicone
  • Fyldstof materiale: Silver-plated aluminum
  • Pakketype: 1.5 Fluid Ounce Foil Tube, 6 Fluid Ounce SEMCO Cartridge
  • Farve: Gray
  • Volumenmodstand: 0.010 Ω-cm
  • Omgangsforskydningsstyrke: 689 kPa
  • Specifik tyngdekraft: 2
  • Durometer: 81
  • Driftstemperatur: -55 to 200 °C
  • Driftstid: 0.25 Hours
  • Holdbarhed: 6 Months
  • Filmtykkelse: 0.25 to 3.18 mm
Safety Warning

Fuld produktbeskrivelse

Parker Chomerics CHO BOND® 1075 is a one component, silver-plated aluminum filled sealant formulated to resist galvanic corrosion on aluminum substrates while providing excellent shielding and conductivity. CHO BOND® 1075 is a gray-colored silicone that is ideally used for filling gaps but can also serve as a repair or bonding agent for elastomer gaskets where moderate strength (100 PSI lap shear strength) is required.

Features and Benefits:
• One-component system so no mixing or measuring required
• Excellent electrical conductivity levels (0.010 ohm-cm)
• Outstanding galvanic corrosion resistance against aluminum substrates
• No corrosive by-products generated during drying
• No volatile organic compounds (VOCs)
• Medium consistency paste makes the material dispensable in overhead or vertical applications
• No pressure required when curing to achieve proper bonding

Typical Applications:
• Man-portable electronics
• Radar and Communication Systems
• EMI vents
• Military Ground Vehicles
• Military Shelters

Relaterede dokumenter

×
Produkter Vægt (g) Primer medfølger
50-02-1075-0000 71 1086
50-02-1075-1000 71 No
50-01-1075-0000 284 1086

687554
179336