Product Catalog - Potting & Encapsulation Materials Catalog

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CoolTherm® EP-6035 Epoxy Encapsulant

CoolTherm® EP-6035 encapsulant is recommended as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting product for use where thermal conductivity & non-burning properties are required.

cooltherm-ep-6035-epoxy-encapsulant

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