Product Catalog - Microelectronic Materials

Product Catalog - Microelectronic Materials Catalog (English A4) - India only

Product Catalog - Microelectronic Materials Catalog (Mexican Spanish)

Thermoset ME-588 Underfill Encapsulant

Thermoset ME-588 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.

thermoset-me-588-underfill-encapsulant

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