THERM-A-GAP Gels T636 Dispensable, Very Low Compression Force, Thermal Gap Fillers | Product Series

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THERM-A-GAP Gels T636 Dispensable, Very Low Compression Force, Thermal Gap Fillers THERM-A-GAP Gels T636 Dispensable, Very Low Compression Force, Thermal Gap Fillers THERM-A-GAP Gels T636 Dispensable, Very Low Compression Force, Thermal Gap Fillers

THERM-A-GAP Gels T636 Dispensable, Very Low Compression Force, Thermal Gap Fillers

Parker Chomerics THERM-A-GAP™ Gel T636 is a highly conformable, pre-cured, single-component compound with 2.4 W/m-K Thermal Conductivity.

Tekniske specifikationer

  • Farve: Yellow
  • Flowhastighed: 8 cc/min
  • Specifik tyngdekraft: 1.2
  • Afbøjning ved tryk: n/a
  • Filmtykkelse: 0.38 mm
  • Termisk ledeevne: 2.4 W/m-K
  • Varmekapacitet: 0.9 J/g-K
  • Termisk ekspansionskoefficient: 400 ppm/K
  • Driftstemperatur: -67 to 392 °F
  • Dielektrisk styrke: 200 VAC/mil
  • Volumenmodstand: 10^14 ohm-cm
  • Dielektrisk konstant: 4 @ 1 MHZ
  • Tabsfactor: 0.003 @ 1 MHZ
  • Specifikationer overholdt: UL 94 V-0, RoHS
  • Afgasning, totalt massetab: 0.49 % TML (0.18% CVCM)
  • Holdbarhed: 18 Months
Safety Warning

Fuld produktbeskrivelse

Parker Chomerics THERM-A-GAP™ T636 gel is a highly conformable, pre-cured, single-component compound with 2.4 W/m-K thermal conductivity. The cross-linked gel structure provides superior long term thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.

Features / Benefits:
• Dispensable
• Fully cured
• Highly conformable at low pressures
• No refrigeration, mixing or filler settling issues in storage
• Single dispensable TIM can eliminate multiple pad part sizes/numbers
• Reworkable

Product Attributes:
• Superior thermal performance
• Solves the toughest heat transfer problems
• Low deflection force required
• Minimal stress on components

Typical Applications:
• Automotive electronic control units (ECUs)
• Engine control
• Transmission control
• Braking/traction control
• Power conversion equipment
• Power supplies and uninterruptible power supplies
• Power semiconductors
• MOSFET arrays with common heat sinks
• Televisions and consumer electronics

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