Thermally Conductive Potting and Encapsulation

CoolTherm® SC-6715/6730 silicone system is a two-component, solvent-free RTV silicone system ideal for potting and encapsulating densely packed components and for producing flexible molds.

CoolTherm® SC-6715/6731 silicone system is a two-component, solvent-free RTV silicone system ideal for potting and encapsulating densely packed components and for producing flexible molds.

CoolTherm® SC-6717/6731 system is a two-component, solvent-free RTV silicone system is ideal for potting, encapsulating and coating applications.

CoolTherm® SC-6725 encapsulant is a two-component, thermally conductive, addition-cure silicone system used in applications where high temp service is required. It cures to a red elastomer which adheres to most substrates without the use of a primer.

CoolTherm® SC-6726 encapsulant is a two-component, addition-cure silicone system for use in applications where high temperature service is required. It adheres to most substrates without the use of a primer.

CoolTherm® UR-288 encapsulant is a two-component urethane system designed for encapsulating and casting applications. It cures at room temperature to produce a flame retardant, semi-flexible material.

CoolTherm® UR-388 FST (fast) encapsulant is a two-component urethane system designed for encapsulating and casting applications. It cures at room temperature to produce a flame retardant, semi-flexible material.

CoolTherm® UR-388 encapsulant is a two-component urethane system designed for encapsulating and casting applications. It cures at room temperature to produce a flame retardant, semi-flexible material.

CoolTherm® UR-389 encapsulant is a two-component urethane system designed for encapsulating and casting applications. It cures at room temperature to produce a flame retardant, semi-flexible material.

THERM-A-FORM™ T642 est un matériau à hautes performances thermiques, souple, à faible dégagement gazeux, idéal pour le sous-remplissage.

Le THERM-A-FORM™ 1641 est un élastomère de silicone monocomposant thermoconducteur, hygrodurcissant, vulcanisé à température ambiante, fourni avec le primaire 1086 (qui favorise l'adhérence) ne générant pas d'acide acétique.

Le THERM-A-FORM™ 1642 est un matériau bicomposant économique, à usage général, pour encapsulation/étanchéité/calfeutrage/enrobage.

THERM-A-FORM™ T647 est un matériau à hautes performances thermiques et à faible module qui s'écoule dans des géométries complexes afin de maintenir un contact étroit avec les composants.

THERM-A-FORM™ T646 est une option à hautes performances thermiques et à faible coût pour les applications d'encapsulation thermique/étanchéité/calfeutrage/enrobage.

L'apprêt Chomerics CHO-BOND 1087 est un liquide bleu à faible viscosité, formulé pour assurer l'adhérence entre notre composant à base de silicone CHOTHERM 1642 et des substrats non siliconés, tels que les métaux, le verre, le plastique…

CoolTherm® EP-2000 encapsulant is a two-component, low viscosity epoxy system designed for encapsulation of devices with small-diameter, tightly-packed windings. It provides high-temperature stability combined with excellent electrical insulation.

CoolTherm® EP-301 AD resin is a general purpose epoxy resin designed for use with CoolTherm EP-6010 hardener to create a two-component system for applications requiring excellent heat transfer, high fluidity and good air release.

CoolTherm® EP-340/18 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

CoolTherm® EP-340/67 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

CoolTherm® EP-340/70 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.

CoolTherm® EP-3500 epoxy system is a two-component system for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.

CoolTherm® EP-3500/EP-2000 two-component epoxy system is for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.

CoolTherm® EP-6008 BLK/6010 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.

CoolTherm® EP-6008 BLK/6252 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.

CoolTherm® EP-6008 BLK/Thermoset No.67 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.

Parker Chomerics THERM-A-FORM™ thermally conductive compounds are two-component materials that require a cure and are used on complex geometries for cooling of multiple height heat generating components without the expense of molded sheets or gap pads.  Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures. They differ from THERM-A-GAP™ GEL dispensable materials, which are single component and do not require a cure. CoolTherm® potting and encapsulants improve performance by optimizing heat dissipation with high thermal conductivity and low viscosity. They also protect components from dust and moisture and help reduce vibration

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