Thermoset ME-456 encapsulant is a one-component, semiconductor grade epoxy dam material designed for use in the encapsulation of wirebonded or flip chip devices where a dam is needed to restrict flow of a cavity fill encapsulant. It is formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications and minimize the chances of ion-induced corrosion in these devices.
Thermoset ME-456 encapsulant offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces. It can be used in demanding high-end, consumer and automotive applications.

Features and Benefits:
• High Viscosity – allows easy dispensing around perimeter of encapsulation area.
• High Thixotropic Index – material retains dispensed profile, will not self-level and slump before cavity fill encapsulant is applied.
• Low Stress – exhibits low shrinkage and stress on components as it cures.
• Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during temperature cycling; provides excellent temperature shock performance.
• Fast Cure – quickly cures at 150°C, leaving no pits or voids for a smooth surface.

Shelf Life/Storage:
Shelf life is six months when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
This material is shipped and stored frozen. Consult handling instructions for this product for thawing warnings and instructions.