Parker's HF359-80 is a cost-effective semiconductor solution with improved etch resistance over other Hifluor options. HF359 is the ideal solution for areas of the tool where FFKM materials are excessive. HF359 has improved cleanliness and plasma resistance compared to fluorocarbon, but is a cost-effective alternative to FFKM.

• Heat Resistance - Up to 204°C (400°F)
• Cold flexibility - Down to -26°C (-15°F) static and -18°C (0°F) dynamically

Chemical resistance includes
• Good plasma and etch resistance
• Aliphatic and aromatic hydrocarbons
• Chlorinated hydrocarbons
• Inorganic and organic acids

Not compatible with:
• Fluorinated refrigerants (R11, 12, 13, 113, 114, etc.)
• Perfluorinated lubricants (PFPE)

Used for chemical vapor deposition and processes.
Ideal for KF flanges, turbo valves, and downstream environments.

*Custom sizes and coatings/markings are available upon request. Contact Parker O-Ring & Engineered Seals Division at 859-269-2351 for design and pricing assistance.