Parker's HF355-65 has high purity with extremely low particle generation and ion content. Translucent in color, the material is free of inorganic and black filler system. Hifluor has improved cleanliness compared to fluorocarbon, but is a cost effective alternative to FFKM. The chemical and plasma etch resistance make HF355-65 an excellent material for semiconductor applications. In addition, meeting the strict extraction requirements of USP Class VI, HF355-65 is well suited Life Science.
• Heat Resistance - Up to 204°C (400°F)
• Cold flexibility - Down to -26°C (-15°F) static and -18°C (0°F) dynamically
Certifications and features include
• USP Class VI
• Good plasma and etch
• Animal free
Chemical resistance includes
• Aliphatic and aromatic hydrocarbons
• Chlorinated hydrocarbons
• Polar solvents (ketones, esters, ethers)
• Inorganic and organic acids
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Not compatible with:
• Fluorinated refrigerants (R11, 12, 13, 113, 114, etc.)
• Perfluorinated lubricants (PFPE)
*Custom sizes and coatings/markings are available upon request. Contact Parker O-Ring Division at 859-269-2351 for design and pricing assistance.
