Product Catalog - Microelectronic Materials

Product Catalog - Microelectronic Materials Catalog (English A4) - India only

Product Catalog - Microelectronic Materials Catalog (Mexican Spanish)

Product Catalog - Potting & Encapsulation Materials Catalog

Product Catalog - Potting & Encapsulation Materials Catalog (Chinese) - China only

Product Catalog - Potting & Encapsulation Materials Catalog (English A4) - India only

Product Catalog - Potting & Encapsulation Materials Catalog (Mexican Spanish)

Thermoset LS 213-9 Epoxy Encapsulant

Thermoset LS 213-9 encapsulant is a one-component epoxy impregnating compound for use in electrical lamination and potting applications. It can also be used as a reworkable underfill encapsulant.

thermoset-ls-213-9-epoxy-encapsulant

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