Electronic Potting and Encapsulation

Circalok 6055 encapsulant is a two-component epoxy encapsulating system designed for encapsulating and casting applications where non-burning properties are required.

Circalok 6250 hardener is a curing agent designed for use with various Circalok epoxy resins to obtain high solids formulations useful in adhesive, electrical encapsulation and laminate applications.

Circalok 6403 A BLK/B urethane encapsulant is a general purpose, two-component urethane designed for applications requiring a fast cure, mechanical shock-resistant system. Circalok 6403 A BLK/B urethane encapsulant does not contain MOCA or TDI.

Circalok 6403 A SLW/B urethane encapsulant is a general purpose, two-component urethane designed for applications requiring a fast cure, mechanical shock-resistant system. Circalok 6403 A SLW/B urethane encapsulant does not contain MOCA or TDI.

Circalok 6408 A SLW/B urethane encapsulant is a solvent-free, two-component system designed to provide a shock-resistant sealant for encapsulating and potting applications.

Circalok 6410 A/B urethane encapsulant is a two-component system formulated for tooling mechanical goods and model making. Circalok 6410 encapsulant is an easy handling casting elastomer designed for room temperature mixing, pouring and curing.

Circalok 6716/6733 silicone system is a two-component, solvent-free RTV silicone system ideal for potting and encapsulating both low- and high-voltage electrical and electronic assemblies.

Circalok 6735 encapsulant is a two-component, addition-cure silicone system for applications where high temperature service and flexible system are required. It adheres to most substrates without the use of a primer.

Circalok 6744 encapsulant is a two-component silicone system for use in applications requiring a low viscosity, flame retardant encapsulating material.

LORD® 600/18 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

LORD® 600/25 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

LORD® 600/37 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

LORD® 600/65 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

LORD® 600/66 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

LORD® 600/67 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

LORD® 600/70 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

LORD® 600/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.

LORD® 975-1052 encapsulant is a two-component epoxy system designed specifically for encapsulating electronic components used in remote sensors and sensing devices. It provides a semi-rigid epoxy system for applications where thermal shock is expected.

Thermoset 300/18 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 300/65 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 300/67 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 300/70 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 300/72 epoxy system is a two-component, general purpose filled epoxy system which offers improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.

Thermoset 311 epoxy encapsulant is a two-component, filled epoxy system designed for electrical & electronic applications requiring high operating temperatures and applications where high thermal shock is expected. It provides a semi-rigid epoxy system.

Thermoset DC-812 epoxy encapsulant is a two-component system designed specifically for potting high voltage, automotive ignition coils.

<p>These materials are crucial in applications where fragile electronics need to be protected from environmental and chemical corrosion and vibration.</p>

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