Parker Chomerics THERM-A-GAP™ T636 gel is a highly conformable, pre-cured, single-component compound with 2.4 W/m-K thermal conductivity. The cross-linked gel structure provides superior long term thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.

Features / Benefits:
• Dispensable
• Fully cured
• Highly conformable at low pressures
• No refrigeration, mixing or filler settling issues in storage
• Single dispensable TIM can eliminate multiple pad part sizes/numbers
• Reworkable

Product Attributes:
• Superior thermal performance
• Solves the toughest heat transfer problems
• Low deflection force required
• Minimal stress on components

Typical Applications:
• Automotive electronic control units (ECUs)
• Engine control
• Transmission control
• Braking/traction control
• Power conversion equipment
• Power supplies and uninterruptible power supplies
• Power semiconductors
• MOSFET arrays with common heat sinks
• Televisions and consumer electronics