Parker Chomerics THERM-A-GAP™ TC50 is a high performance, one component, dispensable thermal compound developed to conduct heat between a hot component and a heat sink or enclosure. The TC50 compound provides low thermal impedance at multiple gaps to allow the use of common heat spreaders. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. TC50 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

This one component material is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.

Features and Benefits:
• Thermal conductivity: 5.0 W/m-K
• Easily Dispensed
• No secondary curing required
• Low Thermal Impedance
• Ultra-low compression force
• Reworkable
• Able to accommodate a variety of bond line applications

Typical Applications:
• Automotive Electronic Control Units
• Power Supplies and Semiconductors
• Memory and Power Modules
• Microprocessors
• Consumer Electronics