CoolTherm® ME-555 Underfill Encapsulant

CoolTherm® ME-555 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.

cooltherm-me-555-underfill-encapsulant

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