THERM-A-GAP CIP 60 Thermally Conductive Cure-In-Place Compound

Parker Chomerics THERM-A-GAP CIP 60 is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 6.0 W/m-K thermal conductivity.

therm-a-form-cip-60-thermally-conductive-cure-in-place-compound

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