Catálogo: Microelectrónicos materiales

Product Catalog - Microelectronic Materials

Product Catalog - Microelectronic Materials Catalog (English A4) - India only

Thermoset ME-456 Dam Encapsulant

Thermoset ME-456 encapsulant is a one-component, semiconductor grade epoxy dam material for use in the encapsulation of wire-bonded or flip chip devices where a dam is needed to restrict flow of a cavity fill encapsulant.

thermoset-me-456-dam-encapsulant

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