Thermoset ME-588 BK Underfill Encapsulant

Thermoset ME-588 BK encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.

thermoset-me-588-bk-underfill-encapsulant

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