Product Catalog - Microelectronic Materials

Product Catalog - Microelectronic Materials Catalog (English A4) - India only

Product Catalog - Microelectronic Materials Catalog (Mexican Spanish)

Thermoset ME-430 Board Level Encapsulant

Thermoset ME-430 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of COB devices. Offers good adhesion to laminate & ceramic substrates. Can be used in high-end, consumer printed circuit board and semiconductor applications.

thermoset-me-430-board-level-encapsulant

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