Thermally Conductive Liquid Dispensed Adhesives

CoolTherm® MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications. It is low stress, making it suitable for use with large die.

CoolTherm® MD-140 SP (Small Particle) silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications. It is low stress, making it suitable for use with large die.

CoolTherm® EP-6007 BLK/6010 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.

CoolTherm® EP-6007 BLK/Thermoset® No.67 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.

CoolTherm® EP-6037/6010 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices.

CoolTherm® EP-6037/6252 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices.

CoolTherm® EP-6150 adhesive is a one-component, thixotropic epoxy adhesive for use in the assembly of electronic components and devices. Offers good adhesion to wide variety of substrates; can be used in demanding high-end device assembly applications.

CoolTherm® EP-6151 adhesive is a one-component, aluminum-filled epoxy adhesive designed for use as a thermal interface adhesive for heat sink attachment and other applications requiring good adhesion and heat transfer properties.

CoolTherm® EP-6960 silver-filled conductive adhesive offers excellent electrical conductivity and room temperature stability. It is designed for use with automated dispensing, stamping and screen-printing application equipment.

CoolTherm® EP-6972 adhesive is a two-component, silver-filled, epoxy conductive adhesive which offers good electrical and thermal conductivity. This adhesive system requires an elevated temperature cure, and is designed for general circuit board repair.

CoolTherm® EP-96 adhesive is a one-component, thixotropic epoxy adhesive for use in the assembly of electronic components and devices. This adhesive is a modified version of CoolTherm EP-6150 adhesive with enhanced air-release characteristics.

CoolTherm® MT-125 thermally conductive adhesive is a rapid cure, one-component adhesive specifically designed for applications requiring a long working life adhesive with high thermal conductivity.

CoolTherm® MT-220C thermally conductive adhesive is a fast cure, one-component, silicone hybrid adhesive used for bonding silicone to silicone and metal to metal, as well as ceramic, plastic or metal lids to a heat sink.

CoolTherm® MT-322 thermally conductive adhesive is a one-component silicone adhesive for use in assemblies where thermal dissipation is desired. Adhesive cures to form flexible elastomer offering superior high temperature electrical properties.

CoolTherm® TC-2002 adhesive is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.

CoolTherm® EP-6007 BLK/6252 epoxy system is used as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a potting/casting product when thermal conductivity & non-burning properties are required.

CoolTherm® TC-850 adhesive is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.

This product is no longer available - please contact us for further assistance.

<p>Whether you need structural integrity or an improved thermal connection, these adhesives allow design flexibility and the ability to bond a variety of substrates. Our adhesives couple high-bond strength with thermal conductivity for ease of use and cost-savings.</p>

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