EMI 屏蔽膜工程板

Parker Chomerics CHO-STRAP® 絕緣接地帶由銅和聚酯製成，用於低阻抗接地。

Parker Chomerics 工程層壓板結合導電材料與絕緣體，提供EMI屏蔽。

Parker Chomerics family of engineered laminates for EMI shielding and grounding consist of foil and film dielectrics adhesively joined for a custom laminate solution.  The electrically conductive portion includes: aluminum, copper, or tin-plated copper foil; nickel-plated copper, polyester taffeta; nickel-plated silver, nylon taffeta; and nickel-plated silver, nylon rip-stop.  Available dielectrics include: mylar; PVC; polypropylene (Formex™); and Kapton®.  Adhesive offerings include:  acrylic; electrically conductive acrylic; fire retardant conductive acrylic, and silicone.

emi-shielding-engineered-laminates

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This store is mainly access by Taiwan users