Parker Chomerics THERM-A-GAP™ GEL 37 is the next generation of THERM-A-GAP GELs, with an increased flow rate and higher thermal conductivity than GEL 30. It is specifically designed for more consistent and repeatable dispensing by minimizing batch-to-batch flow rate variations in high volume applications.

Like all THERM-A-GAP GELs, it is a fully cured dispensable material designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It requires no mixing or curing, providing superior design flexibility.

Features/Benefits:

• Easily dispensable

• Fully-cured / No pump out

• High bulk thermal conductivity

• Low thermal impedance

• Ultra low compression force

• High tack surface & reworkable

• Proven long-term reliability

Product Attributes:

• Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders

• Proven reliability in extreme temperature cycling and shock & vibration

• Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.

• Accommodates a variety of bond line thicknesses for application to multiple devices

• Successfully used to fill a variety of different gap thickness

• Compatible with high volume, automated dispense processes

• Meets Telcordia (Bellcore) silicone specifications

Typical Applications:

• Automotive Electronic Control Units (ECUs)

• Power Supplies & Semiconductors

• Memory & Power Modules

• Microprocessors / Graphics

• Processors

• Flat Panel Displays & Consumer Electronics

THERM-A-GAP GEL 37 导热凝胶