CHO-BOND 1075 Silver-Plated Aluminum Filled Silicone Electrically Conductive Sealant for Corrosion Resistance | Parker NA

CHO-BOND 1075 Silver-Plated Aluminum Filled Silicone Electrically Conductive Sealant for Corrosion Resistance

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Parker Chomerics CHO BOND® 1075 is a one component, silver-plated aluminum filled sealant formulated to resist galvanic corrosion on aluminum substrates while providing excellent shielding and conductivity

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Product Overview

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Description

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Tech Specifications

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Description

Performance Characteristics

Polymer Material Options

Silicone

Filler Material

Silver-plated Aluminum

Package Type

1.5 Fluid Ounce Foil Tube
6 Fluid Ounce SEMCO Cartridge

Color

Gray

Volume Resistivity

0.010 Ω-cm

Lap Shear Strength

689 kPa

Specific Gravity

Durometer

Operating Temperature

-55 to 200 °C

Operating Time

0.25 Hours

Shelf Life

6 Months

Film Thickness

0.25 to 3.18 mm

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FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE. This document and other information from Parker-Hannifin Corporation, its subsidiaries and authorized distributors provide product or system options for further investigation by users having technical expertise. The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components and assuring that all performance, endurance, maintenance, safety and warning requirements of the application are met. The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in the current product catalog and in any other materials provided from Parker or its subsidiaries or authorized distributors. To the extent that Parker or its subsidiaries or authorized distributors provide component or system options based upon data or specifications provided by the user, the user is responsible for determining that such data and specifications are suitable and sufficient for all applications and reasonably foreseeable uses of the components or systems...

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