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CHO-FORM 5541 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing
Parker Chomerics CHO-FORM® 5541 form-in-place EMI gasket is a thermal cure silicone system with >65 dB shielding effectiveness, good galvanic corrosion resistance and superb adhesion properties.
Product Overview
Tech Specifications
Product Support
Brochure: EMI/EMC and Product Safety Compliance Testing Services
Datasheet: CHO-FORM and ParPHorm Form-In-Place (FIP) EMI Gaskets
Handbook: Chomerics Conductive Elastomer Engineering Handbook
Parker Chomerics North America Terms and Conditions of Sale
Request a Chomerics Product Sample
Find Your Local Parker Chomerics Sales Rep or Distributor
Request a Quote
Parker Chomerics Safety Data Sheets (SDS)
Product Compliance: China RoHS Compliant
Product Compliance: EU PFOS Compliant
Product Compliance: EU RoHS Compliant
Product Compliance: REACH SVHC Meets Requirements
Safety Data Sheet (SDS): CHO-FORM 5541
Test Report: CHO-FORM 5541 Reliability
Test Report: CHO-FORM 5541 and 5550 Compression Deflection
Test Report: CHO-FORM 5541 and 5550 Corrosion Test
Test Report: CHO-FORM 5541 and 5550 Long Term Aging
Parker Chomerics Product Case Studies
Parker Chomerics Upcoming Webinars & On Demand Webinars
Find the Right EMI Shielding Form-In-Place (FIP) Gasket Material For You
Description
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Parker Chomerics CHO-FORM® family of conductive form-in-place gasket materials are ideal for densely populated electronics packaging, especially where intercompartmental isolation is required. The form-in-place characteristics mean that CHO-FORM® can be used in rapid prototyping applications on substrates such as castings, machined metal, conductive plastic housings, and at board level.
Parker Chomerics CHO-FORM® 5541 form-in-place EMI gasket is a one-component, thermal cure silicone system with greater than 65 dB shielding effectiveness as well as good galvanic corrosion resistance on mated aluminum surfaces and superb adhesion properties. CHO-FORM® 5541 consists of a Ni/Graphite particle filler and utilizes a thermal cure technology which allows for a minimal cure cycle of only 30 minutes at 150°C.
Features and Benefits:
• Up to 60% reduced installation cost and nominal cost for production scale-up
• Up to 60% space savings within enclosures (gasketing available for flanges as narrow as 0.025 in)
• Excellent adhesion to common housing substrates (4-12 N/cm adhesion)
• Highly compressible gaskets, ideal for low closure force housings
• Quick turn-around of prototypes and samples
Parker Chomerics Capabilities:
• Fully programmable 3 axis application technology
• Tight dimensional control and bead termination (0.001-inch tolerance of bead size)
• Automated dimensional verification of gasket bead placement using optical measuring technology
Typical Applications:
• Densely populated electronics packaging
• PCB inter-compartmental isolation with thin wall boundaries
• Castings, machined metal, and conductive plastic enclosures
• Transportation/Automotive sensor housing
• Military and Aerospace electronics
• Telecom
• Life Science
Description
Performance Characteristics
Storage Temperature
-10 °C
Package Type
12 Fluid Ounce Aluminum Cartridge
Operating Features
Corrosion Resistant, High Temp
Filler Material
Ni/C
Polymer Material Options
Silicone
Product Type
Thermal
Durometer
75 Shore A
Tensile Strength
3.5
Specific Gravity
2.4
Volume Resistivity
0.030 Ω-cm
Specifications Met
UL 94 V-0
Noise Shielding Level
> 65 dB
Shelf Life
6 Months
FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE. This document and other information from Parker-Hannifin Corporation, its subsidiaries and authorized distributors provide product or system options for further investigation by users having technical expertise. The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components and assuring that all performance, endurance, maintenance, safety and warning requirements of the application are met. The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in the current product catalog and in any other materials provided from Parker or its subsidiaries or authorized distributors. To the extent that Parker or its subsidiaries or authorized distributors provide component or system options based upon data or specifications provided by the user, the user is responsible for determining that such data and specifications are suitable and sufficient for all applications and reasonably foreseeable uses of the components or systems...
