THERMFLOW Phase-Change Thermal Interface Pads | Parker NA
179336
179336

THERMFLOW Phase-Change Thermal Interface Pads

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Parker Chomerics THERMFLOW phase-change thermal Interface Materials (TIMs) are solid at room temperature and become liquid at the phase-change temperature, completely filling interfacial air gaps and voids.

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Description
    Parker Chomerics THERMFLOW® phase-change materials are designed to displace entrapped air between power dissipating electronic components. Phase-change materials maximize heat sink performance and improve component reliability. THERMFLOW pads soften as they reach component operating temperatures. Upon reaching operating temperature, THERMFLOW materials will fully change phase and attain minimum bond-line thickness (MBLT) to maximize surface wetting. This results in practically no thermal contact resistance due to a very small thermal resistance path.

    At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. With light clamping pressure, they will readily conform to both mating surfaces. Standard THERMFLOW products are electrically non-conductive, however metal-to-metal contact is possible after the material undergoes phase-change, decreasing their electrical isolation properties. PC07DM-7 is the only THERMFLOW material recommended for use as a dielectric insulator. Parker Chomerics offers two types of phase change materials—traditional thermal interface pads (PCM) and dual phase change polymer solder hybrids (PSH)

    THERMFLOW T557, T558 and T777 are dual phase change polymer solder hybrid (PSH) thermal interface materials. This means that both binder and filler change phases, which helps to exhibit the lowest thermal impedance of the THERMFLOW family. These thermal interface materials provide superior long-term reliability performance. For optimum performance, THERMFLOW must be exposed to temperatures above 64°C during operation or by a burn-in cycle to achieve lowest thermal impedance and highest thermal performance.

    Typical Applications

    • Microprocessors
    • Graphics processors
    • Chipsets
    • Memory modules
    • Power modules
    • Power semiconductors

    Features and Benefits

    • Low thermal impedance
    • Proven solution – years of production use in personal computer OEM applications
    • Demonstrated reliability through thermal cycling and accelerated age testing
    • Can be pre-applied to heat sinks
    • Protective release liner prevents contamination of material prior to final component assembly
    • Tabs available for easy removal of release liner (T710, T725, T557, T777, PC07DM-7)
    • T710 is available with PSA only
    • Available in custom die-cut shapes, kiss-cut on rolls


Description

Performance Characteristics

Color

Pink
Gray
Gray/Gray Foil
Light Gray/Off-White
Purple/Gray Foil

Carrier Type

1 Mil Polyester
1 Mil Metal Foil
2 Mil Fiberglass
None - Free Film

Specific Gravity

1.1 to 3.65

Operating Temperature

-67 to 257 °F
-55 to 125 °C

Product Type

Traditional Phase Change
Dual Phase Change

Volume Resistivity

10^14 ohm-cm
Non-Conductive

Shelf Life

12 Months

Flammability Rating

Not Tested
UL 94 V-0

FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE. This document and other information from Parker-Hannifin Corporation, its subsidiaries and authorized distributors provide product or system options for further investigation by users having technical expertise. The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components and assuring that all performance, endurance, maintenance, safety and warning requirements of the application are met. The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in the current product catalog and in any other materials provided from Parker or its subsidiaries or authorized distributors. To the extent that Parker or its subsidiaries or authorized distributors provide component or system options based upon data or specifications provided by the user, the user is responsible for determining that such data and specifications are suitable and sufficient for all applications and reasonably foreseeable uses of the components or systems...

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