THERM-A-GAP TC50 High Performance Dispensable Thermal Putty | Parker NA
179336
179336

THERM-A-GAP TC50 High Performance Dispensable Thermal Putty

Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity

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제품 개요
Description
    Parker Chomerics THERM-A-GAP™ TC50 is a high performance, one component, dispensable thermal compound developed to conduct heat between a hot component and a heat sink or enclosure. The TC50 compound provides low thermal impedance at multiple gaps to allow the use of common heat spreaders. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. TC50 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

    This one component material is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.

    Features and Benefits:
    • Thermal conductivity: 5.0 W/m-K
    • Easily Dispensed
    • No secondary curing required
    • Low Thermal Impedance
    • Ultra-low compression force
    • Reworkable
    • Able to accommodate a variety of bond line applications

    Typical Applications:
    • Automotive Electronic Control Units
    • Power Supplies and Semiconductors
    • Memory and Power Modules
    • Microprocessors
    • Consumer Electronics
기술 사양
Description

성능 특성

색상

Gray

유량

10 g/min

비중

3.25

필름 두께

0.006 inch

열전도도

5 W/m-K

열팽창 계수

150 ppm/K

작동 온도

-67 to 392 °F

가연성 등급

UL 94 V-0

탈기 총 질량 손실

0.07 %

보관 수명

18 Months

제품 지원