THERM-A-GAP TC50 高性能导热凝胶 | Parker NA
179336
179336

THERM-A-GAP TC50 高性能导热凝胶

电子邮件 印刷

单击缩放

Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity

Select attributes to refine your product search.
重置属性
产品概览
Description
    Parker Chomerics THERM-A-GAP™ TC50 is a high performance, one component, dispensable thermal compound developed to conduct heat between a hot component and a heat sink or enclosure. The TC50 compound provides low thermal impedance at multiple gaps to allow the use of common heat spreaders. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. TC50 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

    This one component material is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.

    Features and Benefits:
    • Thermal conductivity: 5.0 W/m-K
    • Easily Dispensed
    • No secondary curing required
    • Low Thermal Impedance
    • Ultra-low compression force
    • Reworkable
    • Able to accommodate a variety of bond line applications

    Typical Applications:
    • Automotive Electronic Control Units
    • Power Supplies and Semiconductors
    • Memory and Power Modules
    • Microprocessors
    • Consumer Electronics
技术规格
Description

性能特点

颜色

Gray

流速

10 grams/min

比重

3.25

薄膜厚度

0.006 mm

热导性

5 W/m-K

热膨胀系数

150 ppm/K

工作温度

-67 to 392 °F

易燃性等级

V-O

脱气总质量损失

0.07 %

保质期

18 Months

View more
产品支持

联系我们

Close [ x ]
Full Screen