UHP Bulk Diaphragm Valve — BDV Series | Parker NA

UHP Bulk Diaphragm Valve — BDV Series | Product Series

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UHP Bulk Diaphragm Valve — BDV Series

UHP Bulk Diaphragm Valve — BDV Series

The BDV Series is a "positive retraction" diaphragm valve that enables precise control of gas and liquid distribution in semiconductor manufacturing processes.

Technische Daten

  • Gehäusematerial: 316L Stainless Steel
  • Membranmaterial: 316L Stainless Steel
  • Sitzmaterial: PCTFE (std), Polyimide
  • Schaftmaterial: 416 Stainless Steel
  • Knopfmaterial: ABS (std), Aluminum (high temperature)
  • Berstdruck: 900 psig, 62 barg
  • Prüfdruck: 450 psig, 31 barg
  • Durchfluss: 2.8 Cv
  • Interne Leckagerate: ≤ 1 x 10-9 scc/sec He
  • Externe Leckagerate: ≤ 2 x 10-10 scc/sec He Inboard, ≤ 1 x 10-9 scc/sec He Outboard
  • Oberflächenbearbeitung: 10 micro inch Ra (Standard)
  • Maximaler Nenneingangsdruck: 300 psig, 21 barg
  • Maximale Betriebstemperatur: 150°F (PCTFE), 302°F (Polyimide) °F, 66°C (PCTFE), 150°C (Polyimide) °C
  • Minimale Betriebstemperatur: -40 °F, -40 °C
Safety Warning

Vollständige Produktbeschreibung

The BDV Series diaphragm valve enables precise control of gas and liquid distribution in semiconductor manufacturing processes.


The BDV is a positive retraction diaphragm valve that features a flexible tied-diaphragm design to control flow of the media. When the valve is actuated, the diaphragm moves up or down. In the open position, the diaphragm lifts, allowing the media to flow. In the closed position, it seals against a valve seat, stopping the flow.


All BDV Series valves are cleaned to exacting semiconductor industry requirements and assembled in class 100 cleanroom environments. Prior to shipping, all valve seals (seat and diaphragm) are 100% Helium leak tested using a mass spectrometer to ensure performance and reliability in demanding UHP applications.

Markets:
•Fluid & gas handling
•Process control
•Semiconductor
•Analytical Laboratory
•Pharmaceutical
•BioPharm
•Aerospace
•Industrial


Applications:
•Semiconductor Sub-Fab gas lateral systems
•Bulk Gas Delivery
•Tool Hook-ups
•Valve Manifold Boxes (VMBs)


Features and Benefits:
•Ideal for high-flow, low-pressure applications
•Standard surface finish of 10 micro inch Ra
•Fully functional from vacuum to 300 psig
•Minimal particle generation and gas entrapment
•Metal-to-metal external seal
•Tied diaphragm eliminates springs in wetted area and enhances safety
•Internal leak rate: ≤ 1 x 10-9 scc/sec He
•Internal leak rate: ≤ 2 x 10-10 scc/sec He
•Flow rate: 2.8

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