Parker Chomerics THERM-A-GAP™ T630 gel is a highly conformable, pre-cured, single-component compound with 0.7 W/m-K thermal conductivity. The cross-linked gel structure provides superior long term thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.

Features / Benefits:
• Dispensable
• Fully cured
• Highly conformable at low pressures
• No refrigeration, mixing or filler settling issues in storage
• Single dispensable TIM can eliminate multiple pad part sizes/numbers
• Reworkable

Product Attributes:
• Years of proven reliability in high-volume automotive applications
• General use material
• Good thermal performance
• Lowest deflection force required
• Minimal stress on components
• “G” version has 0.010” glass beads as compression stops for electrical isolation

Typical Applications:
• Automotive electronic control units (ECUs)
• Engine control
• Transmission control
• Braking/traction control
• Power conversion equipment
• Power supplies and uninterruptible power supplies
• Power semiconductors
• MOSFET arrays with common heat sinks
• Televisions and consumer electronics