Electronic Assembly Adhesives

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Electronic Assembly Adhesives

Electronic Assembly Adhesives

Assemble fragile electronic components with our microelectronics adhesives offered in epoxy, silicone and urethane product types.

Circalok 6027 adhesive is a one-component, thixotropic epoxy adhesive designed for use in SMD component mounting.
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Circalok 6756 primer is designed for use in electronics applications to bond Room Temperature Vulcanized (RTV) silicone rubbers to most metals and glass. It may also be used to bond addition-cure RTV silicones.
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LORD® 2232 solvent is used to reduce viscosity of LORD 2232 silver conductive coating for dip applications. LORD 2232 solvent is specifically designed for use with LORD 2232 silver conductive coating only.
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LORD® 6144 silver conductor is a one-component, thermosetting conductive epoxy designed for surface mount attachment of electronic component devices. It is primarily used as a chip-to-lead frame adhesive for tantalum capacitors.
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LORD® 6144S silver conductor is a one-component, thermosetting conductive epoxy designed for surface mount attachment of electronic component devices. It is primarily used as a chip-to-lead frame adhesive for tantalum capacitors.
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LORD® EX-5640 adhesive is a semi-thixotropic, two-component structural epoxy adhesive system used to bond various materials together for electronic applications.
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LORD® P-1291 primer is designed for use in electronics applications to bond tin-catalyzed Room Temperature Vulcanized (RTV) silicone rubbers to most metals and glass. It may also be used to bond addition-cure silicones.
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LORD® P-1292 primer is designed for use in electronics applications to bond platinum-catalyzed RTV silicone rubbers to most metals and glass.
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LORD® UX-9155 adhesive is a two-component urethane casting elastomer designed for tooling, industrial molding, and other applications where high hardness and convenient processing is required.
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Thermoset 7195-125 Black adhesive is a one-component epoxy adhesive designed for use in SMD component mounting where non-stringing is necessary.
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Thermoset 741 A/B adhesive is a medium viscosity structural adhesive that cures to a tough, high impact polymer and provides exceptional adhesion to a wide variety of substrates. It features rapid cure in thin films and convenient mix ratio by volume.
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Thermoset 945-6443 adhesive is an amber-colored, one-component epoxy designed for a variety of electronics applications.
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Thermoset DC-80 adhesive is a two-component epoxy adhesive system used in varying mix ratios to provide optimum properties.
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Thermoset® MD-130 adhesive is a one-component, micro-electronic adhesive designed for a variety of semiconductor IC packaging applications where electrical conductivity is not required.
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687PDC
687PDC