CHO-BOND 1121 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant (VOC Free)

Parker Chomerics CHO BOND® 1121 is a one component, VOC-free, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding

cho-bond-1121-one-component-electrically-conductive-silicone-sealant-voc-free

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