Parker Chomerics THERM-A-GAPĀ® CIP 60 is a two-component (2k) dispensable thermal gap filler and cure-in-place material with a thermal conductivity of 6.0 W/m-K. With a Shore 00 hardness of 50 at full cure, CIP 60 is designed to be an alternative to harder curing dispensable materials and also to provide an improvement over standard application methods associated with thermal gap filler pads.
As a two-component dispensable material, it can be dispensed in high volumes or used to fill in applications that require heat transfer with challenging geometries.
With a 1:1 mix ratio and packaged in cartridges of various sizes, this material can be easily dispensed through a static mixing tip using either manual or automated dispensing equipment.
Product Features
- Two-part (2k) dispensable material
- Excellent thermal performance, 6.0 W/m-K typical thermal conductivity
- Conformable to irregular shapes
- No pre-mixing or weighing of components required
- Vibration dampening
- Industry leading, ultra-low out-gassing performance for minimal vapor contamination
Typical Applications
- Automotive E-mobility (Converters, Inverters)
- Automotive Infotainment (Display, HUD, Audio)
- Automotive ADAS (DCU, Camera, Radar/Lidar)
- Energy Storage Application (Residential, Commercial, Grid-level)
- Power Electronics
- Telecommunications Infrastructure
