Parker Chomerics THERM-A-GAP GEL 120 is a reworkable, high performance, one component, silicone, dispensable, thermal interface material with a typical thermal conductivity of 12.0 W/m-K. GEL 120 was developed to reduce thermal junction temperatures and to effectively conduct heat away from heat generating electronics components. As a gap filler it can be used in gaps of various thicknesses created by assembly or manufacturing tolerances, from less than 0.020in (0.5mm) to 0.160in (4mm).

THERM-A-GAP GEL 120 requires very low compressive force to conform under assembly pressure, thereby subjecting components, solder joints, and leads to minimal stresses. This material is a one-component, fully-cured material, meaning that it does not require any secondary curing or additional processes to achieve the listed physical or thermal properties.

As with all Parker Chomerics thermal gels, GEL 120 is formulated to accommodate today’s high-performance needs and high reliability electronics while being ideal for robotic dispensing machines and automated assembly processes. The consistency of GEL 120 enables very tightly controlled dispensing and accurate material placement during assembly, leading to high repeatability and greater throughput.

Product Features
- Very high thermal performance (12.0 W/m-K)
- Easily dispensed
- No secondary curing required
- Very low compression force
- Reworkable
- Single component

Typical Applications
- Telecommunications equipment
- Consumer devices
- Mission critical electronics
- Automotive control units and sensors
- Energy storage devices