CHO-BOND 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant

Parker Chomerics CHO BOND® 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding

cho-bond-1038-one-component-electrically-conductive-silicone-sealant

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