Geles de conducción térmica

Parker Chomerics THERM-A-GAP™ GEL 20 is a dispensable gel that has 2.4 W/m-K Thermal Conductivity as a one component fully cured system.

Parker Chomerics THERM-A-GAP™ GEL 25NS is a single component, non-silicone, dispensable gel with 2.1 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ Gel 30 is a single-component, fully cured, dispensable gel with 3.5 W/m-K Thermal Conductivity

Parker Chomerics THERM-A-GAP™ GEL 30G is a 3.5 W-m/K, fully cured dispensable thermal interface gel with added glass beads for bondline thickness control.

Parker Chomerics THERM-A-GAP GEL 35VT is a one-component, dispensable thermal interface gel material with 3.5 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 37 is a single-component, fully cured, dispensable thermal gel with 3.7 W/m-K Thermal Conductivity, designed for more consistent and repeatable dispensing by minimizing batch-to-batch flow rate variations.

Parker Chomerics THERM-A-GAP™ GEL 40NS is a single-component, non-silicone, fully cured, dispensable gel with 4.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ Gel 45 is a single-component, fully cured, dispensable gel with 4.5 W/m-K Thermal Conductivity

Parker Chomerics THERM-A-GAP™ GEL 50TBL is a single-component, fully cured, dispensable gel with 5.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 50VT is a high performance, one-component, dispensable thermal interface gel material with 5.2 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 60HF is a single-component, fully cured, dispensable gel with 6.2 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 75 fully cured dispensable gel has 7.5 W/m-K Thermal Conductivity as a one component fully cured system.

Parker Chomerics THERM-A-GAP™ GEL 75VT is a high performance, one-component, dispensable thermal interface gel material with 7.5 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ GEL 120 is a high performance, one-component, dispensable thermal interface gel material with 12.0 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP™ Gel 8010 is a single-component, fully cured, thin bond line, dispensable gel with 3.0 W/m-K Thermal Conductivity

Parker Chomerics THERM-A-GAP™ Gel T630 is a highly conformable, pre-cured, single-component compound with 0.7 W/m-K Thermal Conductivity.

Parker Chomerics THERM-A-GAP™ Gel T635 is a highly conformable, pre-cured, single-component compound with 1.7 W/m-K Thermal Conductivity.

Parker Chomerics THERM-A-GAP™ Gel T636 is a highly conformable, pre-cured, single-component compound with 2.4 W/m-K Thermal Conductivity.

Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity

Parker Chomerics THERM-A-GAP® CIP 35 is two component dispensable thermal compound with 2.5 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP® CIP 35E is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity.

Parker Chomerics THERM-A-GAP CIP 60 is a two-component (2k) dispensable thermal gap filler and cure-in-place material with 6.0 W/m-K thermal conductivity.

CoolTherm® MG-120 thermally conductive gel is a one-component, silicone interface material that exhibits low thermal resistance properties of a grease while possessing the integrity of a gel.

CoolTherm® MG-121 thermally conductive gel is a one-component, silicone interface material that exhibits very low thermal resistance properties compared to other thermal interface materials. It is formulated to provide good HAST resistance.

CoolTherm® MG-122 thermally conductive gel is a one-component, silicone interface material that exhibits low thermal resistance properties of a grease while possessing the integrity of a gel. It is specifically developed for excellent HAST resistance.

Parker Chomerics THERM-A-GAP GELs are supplied as pre-cured, single component compounds that can be dispensed over the heat generating component. These unique gel materials result in much lower mechanical stress on delicate components than even the softest gap-filling pads. They are ideal for filling variable gaps between multiple components and a common heat sink.

thermally-conductive-gels

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