Product Catalog - Microelectronic Materials

Product Catalog - Microelectronic Materials Catalog (English A4) - India only

Product Catalog - Microelectronic Materials Catalog (Mexican Spanish)

CoolTherm® ME-543 Underfill Encapsulant

CoolTherm® ME-543 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for encapsulation of densely populated area array flip chip devices. Is formulated with the necessary structural strength to handle over-molding processes.

cooltherm-me-543-underfill-encapsulant

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