Kleje elektroprzewodzące

Parker Chomerics PRO-SHIELD 7058 electrically conductive epoxy combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. Click into part number to purchase online now.

Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required

Parker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required

Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating

Parker Chomerics TECKNIT 8116 conductive adhesive is a two-component, silver-filled epoxy formulated to provide a strong bond and electrical pathway between mating surfaces

Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds

Parker Chomerics CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates

Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics

Parker Chomerics CHO-BOND® 1085 is an air-drying liquid coating used to improve the adhesion of Parker Chomerics CHO-BOND 1029 adhesive to metal and other non-silicone substrates.

Firma Parker Chomerics oferuje elektroprzewodzące kleje, masy uszczelniające i doszczelniające, szczeliwa i smary z rodziny CHO-BOND, przeznaczone do rozwiązywania problemów z ekranowaniem elektromagnetycznym EMI w przypadkach, gdy nie ma możliwości zastosowania zwykłych uszczelnień EMI.

electrically-conductive-adhesives

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