Product Catalog - Microelectronic Materials

Product Catalog - Microelectronic Materials Catalog (English A4) - India only

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Thermoset ME-455 Board Level Encapsulant

Thermoset ME-455 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. Offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces.

thermoset-me-455-board-level-encapsulant

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